The MULTIMOLD project seeks to revolutionise the manufacturing process for complex products based on in-mold electronics (IME) by addressing current limitations in yield, recyclability, and functionality.
Objective
Film insert moulding and in-mould decoration are established processes in injection moulding that enable the production of 3D-shaped objects with seamlessly integrated graphics and a high degree of design freedom. With the emergence of functional printing for circuits and sensors, the field of in-mould electronics has expanded significantly, encompassing a wide range of applications, including human-machine interfaces (HMIs) in automotive and industrial settings, condition monitoring and sensors in energy generation, healthcare, and more.
The manufacturing process for in-mould electronics involves several sub-processes, most of which achieve a high yield of approximately 99%. However, the yield for overmoulding, which is critical for the production of complex products, is limited to a maximum of 85%. This low yield significantly reduces overall efficiency and necessitates costly tooling and process optimisation. Furthermore, current in-mould electronic products, being multi-material composites, are challenging to recycle and do not align with European sustainability and circularity policies.
The limitations of capacitive sensors currently in use exacerbate these challenges. Such sensors are ineffective when used with cold fingers or gloves and lack haptic feedback, leading to a suboptimal user experience. Additionally, the direct lighting from LEDs placed near capacitive sensors generates substantial heat within the injection-moulded parts, reducing durability and negatively affecting the user experience in HMIs.
To address these challenges, the MULTIMOLD project aims to develop the next-generation manufacturing process for complex products incorporating in-mould electronics. This process will utilise a robust, weather-resistant material concept designed for inherent recyclability. The products developed under MULTIMOLD will integrate advanced electronic functionality, multimodal sensors, haptic feedback, and power supply. They will also feature micro- and nano-structured functional surfaces with properties such as light guidance, antibacterial and anti-icing capabilities, easy-to-clean surfaces, and visually appealing textures.
By advancing these innovative solutions, the MULTIMOLD project seeks to revolutionise in-mould electronics, enhancing functionality, sustainability, and user experience.