A community-driven white paper urges that some of Europe’s photonic technologies must soon transition to 300mm wafers, or else risk being left behind.
The move to larger wafers would not just be beneficial for the European photonics industry, it would ensure European sovereignty in critical, dual use technologies. However, it will not be possible without funding and pilot line access, according to the authors.
The 39-page document was created by a Photonics21 focus group of experts from RTOs (research and technology organisations), SMEs and industry across Europe. Importantly, it is officially endorsed by the European nanoelectronics industry association AENEAS.
The paper highlights three main areas of photonics which are ready for and in need of the transition to 300mm:
- micro-bolometer imagers,
- photonic integrated circuits (PICs),
- 300mm ‘tools’ supporting their manufacturing, such as epitaxy techniques and wafer-level testing.
For each sector it goes into detail on applications, the motivation for a move to larger wafers, and market trends. Based on an analysis of market data reports, the white paper points towards €1.8bil in sales and 7300 European jobs by the year 2029 being at stake in these sectors.
The paper points out that, while photonics on 200mm wafers remains important, there is a growing technology gap between 200mm and 300mm Si. For example, the most advanced photolithography tools (e.g. EUV), the most advanced 3D wafer stacking, and sub-90nm CMOS nodes are only available on 300mm wafers. The photonics products/technologies limited to 200mm wafers are thus at risk of being left behind in terms of performance, cost and capacity.
Infrared thermal imaging sensors and PICs are the photonic technologies most in need of these 300mm capabilities. Moreover, both are key to European strategic autonomy and sovereignty. With a move to 300mm wafers underway globally, “anticipating this transition will help build a sovereign European market.”
For these reasons, the white paper calls for support of the European Commission and Member States in achieving the transition to 300mm. In addition to R&D funding, access to 300mm pilot lines should be facilitated where possible. If no 300mm industrial facility in Europe is available for manufacturing infrared thermal imagers and PICs, then a ‘First-of-a-Kind’ mechanism should be activated.